MEMS Sensors Eye Android Smartphones

MEMS Sensors Eye Android Smartphones
Bosch Sensortec

Designed for applications in Android smart phones, the BHI160 and BHA250 MEMS sensors integrated sensor hubs with a best-in-class three- or six-axis MEMS sensor and the company’s Sensortec DSP “Fuser Core”. The devices implement the full Android Lollipop sensor stack and can be updated with software features to support future releases. The BHI160 uses less than 1.55 mA for a complete nine-axis solution including the Fuser Core, integrated accelerometer and gyroscope, and an external magnetometer. The BHI160 and BHA250 both offer identical functionality except that the BHI160 integrates a six-axis inertial measurement unit (IMU), consisting of a three-axis gyroscope and three-axis accelerometer, while the BHA250 omits the gyroscope. The BHI160 is available in a 3 mm x 3 mm x 0.95 mm³ LGA package while the BHA250 comes in a 2.2 mm x 2.2 mm x 0.95 mm³ LGA package. For more information, visit:

Bosch Sensortec
Palo Alto, CA
Mount Prospect, IL

Contact Info

Company: Bosch Sensortec
Country: Germany
Phone number: +49 7121-3535-900

Suggested Articles

IP theft and technology transfer are key components of eight-part deal

According to a Gartner report, global semiconductor revenue totaled $418.3 billion in 2019, down 11.9% from 2018.

3D printed prosthetic arm has Arm M4 processor inside on board built by Particle