ESPOO, Finland -- Picosun Oy has revolutionized cost-effective MEMS manufacturing with high throughput PICOPLATFORM batch ALD cluster technology. MEMS (MicroElectroMechanical Systems; Microsystems) are micrometer-scale, semiconductor-based components that combine e.g. electrical, mechanical, and optical functions. They are present in our everyday electronics in products such as hard disk read heads, inkjet printer nozzles, microphone and videoprojector chips, and airbag controls, tire pressure monitoring, and driving stability systems in cars.
Fast, fully automated and economically feasible batch processing without compromising the strictest process quality and purity requirements of the semiconductor industries is the prerequisite for industrial breakthrough of the next generation MEMS devices. They realize improved data storage, mobile phone, GPS positioning, and automotive control electronics, and healthcare applications such as body area sensors and remote monitoring devices. Combining batch ALD processing with fully automatic, robotized PICOPLATFORM™ vacuum cluster systems enables super-fast throughput of MEMS chips with excellent yield, process purity and uniformity levels.
Within-wafer, wafer-to-wafer, and batch-to-batch film thickness non-uniformity values (1σ) measured with 50 nm Al2O3 process on 200 mm Si wafers (25 wafers/batch) < 1%. The development work for batch ALD cluster technology has been performed in the project Lab4MEMS (1.1.2013 - 31.12.2015), coordinated by ST Microelectronics.
The project Lab4MEMS has received funding from the EC under the ENIAC Nanoelectronics Framework Programme (ENIAC-2012-2) under grant agreement no 325622-2.
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