Material Solutions Advance Chip Miniaturization and Smart Packaging

EMD Performance Materials announces its portfolio of materials solutions for advanced semiconductor manufacturing. Mega-trends represented by big data, automotive electronics, IoT, and an increased interest in green assembly, is expanding the need for advanced semiconductor processing and novel materials solutions. With an innovative portfolio, EMD Performance Materials aims to enable the process of miniaturization supporting the continuance of Moore's law.


Materials to Enable Further Scaling

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The industry faces many scaling-related challenges, while silica still demands the highest quality and reliability with improved efficiency. EMD Performance Materials provides a wide variety of novel solutions to meet these emerging demands and solve miniaturization roadblocks that challenge the limits of physics. The company's advanced precursors for atomic-layer deposition are a turnkey solution for producing very thin, highly controlled conformal films.


The company's Spinfil spin-on dielectric material is designed to create narrow, insulating layers within transistors. Differentiated lithography materials include FIRM® rinse materials for improving photoresist pattern collapse for ArF and KrF lithography process and enabling EUV technology for future device manufacturing; KrF thick-film resists applied as hard masks enable production of 3D NAND staircases; and metal hard mask (MHM) offer superior properties of planarization, gap filling, etch selectivity and strip. These materials solutions play important roles in manufacturing future semiconductor nodes, as well as DRAM and NAND flash chips.


Materials Solutions for Smart Packaging


The continued advancement of smart phones, automotive, IoT and USB are demanding high density devices with smaller form factors. As a result, advanced packaging has become a key solution to further realize miniaturization in the back end, and solve system-level challenges. EMD Performance Materials offers key materials solution for lithography with its innovative liquid-type photoresist for >200μm thickness that achieves very steep patterned walls. In combination of other lithography materials, such as top antireflective coatings and rinses, EMD Performance Materials is able achieve the narrowest and most conformal feature lines for advanced packaging.


Going Green


Eliminating harmful materials from the supply chain is an important step to maintain corporate compliance. EMD Performance Materials offers eco-friendly interconnect and die attach materials to replace lead-based solders, which meet RoHS and REACH compliance. These advanced materials are applied in power devices and expected to serve new memory devices, DRAM, 2D and 3D flash devices.


To fulfill the growing demand for green materials, EMD Performance Materials has invested in a new application lab in San Diego. The facility will provide a best-in-class R&D and analytical environment to support semiconductor application research, optimize the production process, and ensure on-time delivery. The application lab will help power and memory device customers quickly adapt to green materials for their manufacture process.


EMD Performance Materials


EMD Performance Materials is the North America high-tech materials business of Merck KGaA, Darmstadt, Germany, comprising a portfolio of applications in fields such as consumer electronics, semiconductors, lighting, coatings, printing technology, plastics, and cosmetics.


Key products include display materials, LED materials for lighting as well as OLED materials for lighting and displays, functional materials for solar panels and energy solutions, effect pigments as well as active ingredients and fillers for cosmetics, food and pharmaceutical products, effect pigments and functional materials for coatings, printing and plastics and high-purity specialty chemical materials for the electronics and semiconductor industry. Today, the business has about 500 employees around the country with main operations in Philadelphia (PA). For more information, visit 


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