March 31st Application Deadline for ASCO Engineering Scholarship is Fast Approaching

FLORHAM PARK, NEW JERSEY, USA — Feb. 27, 2017 — U.S. students pursuing a degree in engineering are urged to apply for the 2017 ASCO Engineering Scholarship by March 31. ASCO will award two $5,000 scholarships to U.S. engineering students, provide $1,000 grants to their college’s engineering departments, and host the students at “The Amazing Packaging Race” at PACK EXPO International in 2017.

Applications are now being accepted and may be submitted by the program deadline of March 31, 2017. Details and forms are available at www.asco.com/scholarship.

Over the past ten years, ASCO has awarded $90,000 in scholarships to 18 students based on their potential for leadership and for making a significant contribution to the engineering profession. Also, ASCO has provided another $18,000 in grants to the engineering departments of the colleges where the recipients are enrolled.

The ASCO scholarship is merit-based and will be awarded on the candidate’s potential for leadership and for making a significant contribution to the engineering profession, particularly as it relates to the application of fluid control and fluid power technologies. A panel of ASCO executives and independent judges will select the finalists.

Students seeking to submit a scholarship application must be enrolled full-time in an undergraduate or graduate program in an instrumentation, systems, electrical, mechanical, or automation engineering discipline at an accredited U.S. educational institution for the 2017/2018 academic year. Candidates must also maintain at least a 3.2 cumulative GPA on a 4.0 scale, and be a U.S. citizen or legal U.S. resident. The deadline to apply is March 31, 2017. Details and forms are available at www.asco.com/scholarship.

ASCO will award the scholarships at “The Amazing Packaging Race” at PACK EXPO International, to take place in Las Vegas from September 25 – 27, 2017. The race, sponsored by ASCO, is a fun and educational event that pits teams of packaging students, from programs around the country, against each other in a race to gather points by completing tasks at specific PACK EXPO booths.

For more information, visit:
http://www.asco.com
http://www.emerson.com

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