SEOUL, South Korea and CUPERTINO, CA -- MagnaChip Semiconductor Corporation, designer and manufacturer of analog and mixed-signal semiconductor products, announces that it has started to offer 0.18um automotive qualified process technology to foundry customers focused on high reliability automotive semiconductor applications.
This 0.18um automotive process technology consists of modular processes which combine 1.8V/3.3V CMOS, 52V LDMOS/EDMOS, fully isolated 32V nLDMOS and embedded MTP/EEPROM. MagnaChip's proprietary electrical fuse OTP is also included for precision analog trimming. Full combinations of these modular processes serve a wide range of automotive semiconductor SOC products such as, but not limited to, LED lighting, motor drivers, microcontrollers and ASICs.
This process technology is specially designed for reliable operation at high temperatures and is fully AEC compliant conforming to AEC Q100 Grade 0 specification at 150 degrees C. For example, leakage current of 1.8V rated CMOS devices at 150 degrees C is reduced to ¼ of the leakage of 1.8V CMOS of baseline technologies. Endurance of MTP and EEPROM is 100K cycle and 10K cycle at 150 degrees C, respectively. SPICE model and MTP/EEPROM operation is verified up to 175 degrees C. In addition, high density standard cell libraries, SRAM and analog IPs are qualified in this process.
Namkyu Park, Executive Vice President of MagnaChip's Semiconductor Manufacturing Services Division stated, "This is another example of our continued effort to expand our specialty technology portfolio for the automotive market. We are very proud to play an increasing role in the fast-growing automotive semiconductor foundry market and are committed to continuing to provide differentiated technology solutions for our customers."
For more info, go to http://www.magnachip.com