SEOUL, South Korea /PRNewswire-FirstCall/ -- MagnaChip Semiconductor Ltd., a leading designer, developer, and manufacturer of image sensor solutions and mixed-signal and digital multimedia semiconductors, announced that it will introduce Chip Scale Packaging (CSP) to all lines of its imaging products.
CSP allows package sizes down to nearly the size of a semiconductor die and can reduce the total final product packaged size. This technology can enable higher yields than the existing packaging methods of COB and CLCC, which are based on conventional camera module manufacturing processes. By attaching a cover glass directly over the surface of the sensor, the new packaging method helps eliminate performance deterioration caused by particles introduced in the course of the module assembly process. Moreover, the process helps save infrastructure investments in clean-room technology and other facilities required for COB-based module assembly. The new packaging technology can also provide a cost-reduction opportunity for customers currently using CLCC packaging.
Jason Hartlove, senior vice president of the image solutions division said, "MagnaChip is pleased to now offer CSP options to our customers in addition to our existing offerings, which include CLCC packaging, bare wafer, bumped wafer, and reconstructed wafer." Hartlove continued, "With the addition of our new CSP offering, MagnaChip can now serve all customers worldwide based on their different manufacturing platforms."
MagnaChip will provide CSP on its VGA and mega pixel products. VGA products are in mass production, and mega pixel products are now available in sample form with mass production quantities available in Q306.
MagnaChip has a complete suite of demonstration systems and reference designs to support OEMs and integrators during product development. For more information, please see our Web site or contact your local MagnaChip sales office or representative.
About MagnaChip Semiconductor
MagnaChip Semiconductor is a leading designer, developer, and manufacturer of mixed-signal and digital multimedia semiconductors, addressing the convergence of consumer electronics and communications devices. We focus on CMOS image sensors and flat panel display drivers, which are complex, high-performance, mixed-signal semiconductors that capture images and enable and enhance the features and capabilities of both small and large flat panel displays. MagnaChip also provides wafer-foundry services using CMOS high-voltage, embedded-memory, analog, and power-process technologies for the manufacture of IC's for customer-owned designs. MagnaChip has "world-class" manufacturing capabilities and an extensive portfolio of approximately 11,900 registered and pending patents. As a result, MagnaChip is a valued partner in providing leading technology solutions to its customers worldwide.