LDO Regulator Debuts In Breakthrough Bumpless CSP

LDO Regulator Debuts In Breakthrough Bumpless CSP
STMicroelectronics

Heralded as a “breakthrough” in packaging, the LDBL20 200-mA low-dropout (LDO) regulator comes in a 0.47 mm x 0.47 mm x 0.2 mm chip-scale package (CSP). This makes the device a viable candidate for use in wearable and portable devices and for flexible electronics. Reportedly, the chip’s bumpless STSTAMP package breaks through the minimum I/O-area and height limitation imposed by the diameter of traditional flip-chip solder bumps. Other features include a 200-mA output, an input voltage range from 1.5V to 5.5V, a 200-mV typical dropout, rejection (PSRR) of 80 dB at 100Hz and 50 dB at 100 kHz, and a quiescent current of 20 µA no-load, 100 µA full-load, and 0.3µA in standby. An evaluation board, the STEVAL-ISB034V1, is also available. The LDBL20 is in production now with pricing starting from $0.25 each/1,000. A datasheet is available at http://www.st.com/content/ccc/resource/technical/document/datasheet/c5/b3/3d/53/b2/9a/4a/7a/DM00225719.pdf/files/DM00225719.pdf/jcr:content/translations/en.DM00225719.pdf

STMicroelectronics
Burlington, MA
781-861-2650
http://www.st.com
 

Contact Info

Company: STMicroelectronics
Country: Switzerland
Read more on

Suggested Articles

EasyPack 2B debuts with hybrid approach

An accelerometer measures the rate of change of an object’s velocity to monitor its movement.

From cell phones to industrial manufacturing, knowing when an object (or a person!) is nearby is a basic sensing requirement.