Infotonics Selects SUSS Bonding Systems

MUNICH, Germany--(BUSINESS WIRE)--SUSS MicroTec (FWB:SMH) (GER:SMH), a leading supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, announced that Infotonics, a collaborative, world class Center of Excellence in photonics and microsystems, has selected the SUSS ABC200 wafer bonding cluster tool and FC150 device bonder as strategic investments in their MEMS packaging lab.

With corporate partners such as Corning, Eastman Kodak, and Xerox, as well as relationships with over 20 universities, Infotonics has played a central role in groundbreaking work to benefit the biomedical and communications industries. Infotonics' core competencies include the design, simulation, fabrication, packaging, test and metrology for MEMS and MOEMS devices. By using the facilities at Infotonics, customers can develop and deliver innovative products at reduced risk and cost, accelerating their time to market.

"The ABC200 and FC150 will be key components in our suite of core technologies for MEMS fabrication and packaging," said Dr. Nancy Stoffel of the Infotonics Technology Center. "The ABC200 will allow automated precision alignment, cleaning, bonding and inspection all in one system. The ABC 200 cluster tool modularity allows us to run a variety of bonding processes for both R&D and pilot production." For flip chip processes, the FC150 offers configurations from manual to full automation, providing development and pilot production capabilities on a single, upgradeable cost-effective platform.

"With its corporate and university partnerships and technology transfer initiatives, Infotonics is in a unique position to promote MEMS and MOEMS technology transfer to industry," says Michael Kipp, President, Wafer Bonder Division, SUSS MicroTec, Waterbury, Vermont, USA. "We are delighted to partner with them in their important work."

SUSS MicroTec offers advanced wafer bonding solutions for the MEMS, SOI, 3-D interconnect, and Opto-Electronic markets. The SUSS ABC200 is a flexible modular cluster tool design that can integrate several process modules including wafer cleaning, plasma activation, precision wafer alignment, wafer bonding, and in-situ post-bond metrology all in a single system. The SUSS FC150 Automated Device Bonder incorporates a bi-directional microscope and high-precision mechanical stages to translate and rotate the parts during alignment. The FC150 offers best-in-class ± 1 micron post-bond accuracy and a wide range of process capabilities to assemble MEMS and optoelectronic devices.

About SUSS MicroTec
SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders, probe systems and now equipment for C4NP production. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information about SUSS MicroTec, please visit the company's Web site.

About Infotonics
Infotonics is a collaborative, industry-led microsystems R&D center that will drive economic growth and create high-technology businesses from its position as a world-leader in photonics and microsystems innovation and commercialization. The Center is establishing R&D and other strong collaborative programs among industry, university, and government in order to develop and commercialize innovative photonic and microsystems technologies; provide world-class photonic and microsystems prototyping and pilot-line production facilities and infrastructure; and support high-tech businesses and enhance an environment in which they thrive in upstate New York by growing, spinning off, or recruiting high-tech companies.

SUSS MicroTec
Fiona Kemp, Corporate Marketing Manager
Tel. +49 (0)89 32007 395
Email [email protected]

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