BARCELONA, Spain --- Chirp Microsystems unveils the first high-accuracy, ultra-low power ultrasonic sensing development platform for wearables. The new Chirp development platform — which leverages the company’s microelectromechanical systems (MEMS)-based time-of-flight (ToF) sensor — senses tiny “microgestures” with 1mm accuracy, allowing users to interact with wearables and other consumer electronics devices using the smallest of gestures.
Chirp’s ToF sensor is also the foundation for vastly superior virtual reality/augmented reality (VR/AR) experiences, which the company demonstrated privately at Mobile World Congress. Chirp’s ultrasonic sensing development platform for VR/AR enhances the mobility of users, supporting “inside-out tracking” of controllers or input devices with six degrees of freedom, which allows users to interact with the VR/AR environment without being tethered to a base station or confined to a prescribed space. They can literally take their VR/AR systems with them. In VR/AR applications, Chirp’s development platform offers significant benefits over camera-based controller-tracking systems. It makes possible a 360-degree immersive experience because the tracking system moves with the user. It also supports a wide field of view, a vast improvement over the narrow field of view that camera-based systems provide.