Heat Sink Device Provides Non-Inductive, High-Heat Dissipation

New Yorker Electronics is now distributing a heat sink device with enhanced power size ratio, high stability and optimum heat dissipation. The Tepro TO-220 non-inductive, thick-film heat sink resistor comes in a TO-20 type package. Ttypical applications include switching power supplies and various types of pulse circuits. A miniature device, it features a plated copper heat sink, a high stability thick-film element, and tinned copper leads. It also has high temperature thermoset molding.


Custom models are available with variations in lead length, tolerances to 0.5%, and various temperature coefficients. The component’s terminal strength is tested with a 5-lb. pull and its solderability and solvent resistance meet MIL-STD-202 requirements. For more insight, checkout the Tepro TO-220 Non-Inductive, Thick-Film Heat Sink Resistor datasheet.

Sponsored by Anritsu Company

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