Gen4 ToF Image Sensor Delivers HVGA Res

(Infineon Technologies)

Infineon Technologies’ fourth generation of its REAL3 IRS2771C time-of-flight (ToF) image sensor is designed to meet the requirements of the mobile consumer device market and the demand for higher resolutions with small lenses. Apps includes secure user authentication like face or hand recognition to unlock the device and confirm payments. In addition, the 3D ToF chip enhances augmented reality, morphing, and photo effects and can be used to scan a room.

 

Measuring 4.6 mm x 5 mm, the image sensor features a 150 k (448 x 336) pixel output that comes close to the HVGA standard resolution. This makes the resolution four times higher than that of most ToF solutions on the market today. The pixel array is highly sensitive to 940 nm infrared light and provides unbeaten outdoor performance. This is enabled by the patented Suppression of Background Illumination (SBI) circuitry in every pixel.

Sponsored by Infosys

In Conversation with Antonio Neri, President & CEO – Hewlett Packard Enterprise & Salil Parekh, CEO – Infosys

Hear the CEOs of Infosys & HPE discuss the current crisis and how it has accelerated the need for digital transformation for their clients. Connectivity at the Edge, right mix of hybrid cloud, ability to extract data faster than ever before… these are just some of the contributions that HPE and Infosys make to our clients’ digital transformation journey.

 

Samples of the chip will be available in March and volume production is scheduled to start in Q4 2019. For more information, checkout the datasheet and the application brief.

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