Infineon Technologies’ fourth generation of its REAL3 IRS2771C time-of-flight (ToF) image sensor is designed to meet the requirements of the mobile consumer device market and the demand for higher resolutions with small lenses. Apps includes secure user authentication like face or hand recognition to unlock the device and confirm payments. In addition, the 3D ToF chip enhances augmented reality, morphing, and photo effects and can be used to scan a room.
Measuring 4.6 mm x 5 mm, the image sensor features a 150 k (448 x 336) pixel output that comes close to the HVGA standard resolution. This makes the resolution four times higher than that of most ToF solutions on the market today. The pixel array is highly sensitive to 940 nm infrared light and provides unbeaten outdoor performance. This is enabled by the patented Suppression of Background Illumination (SBI) circuitry in every pixel.
Samples of the chip will be available in March and volume production is scheduled to start in Q4 2019. For more information, checkout the datasheet and the application brief.