XJTAG and Flying Test Systems announce the signing of a joint Technology Partner Agreement. Flying Test Systems offer electronic circuit board test and repair services, Design for Test (DFT) consultancy services along with in-circuit, SPEA flying probe and bespoke functional test equipment for production.
XJTAG has been working with a variety of test solution providers including flying probe vendors in order to offer the best-in-class test capability and value for clients. Ensuring continuous DFT improvement and that testing Ball Grid Array (BGA) devices on dense boards does not impact test coverage now means combining JTAG boundary scan, bed-of-nails and flying probe machines to achieve the best results. Powerful and easy to use, integrated testing enables engineers to minimise test time while maximising test coverage by using boundary scan.
As electronic circuits become more complicated the collaboration between leading suppliers is not only helping address the challenges facing engineers today but is also creating test solutions fit for the future. To find out more, visit http://www.xjtag.com and http://www.flyingtest.co.uk