LG Innotek unveils what it’s calling an advanced flip chip LED package that demonstrates high efficiency and high luminous flux without deteriorating performance even after completing the +300℃ soldering process. The company has developed a high-quality flip chip LED package that improves reliability by applying state-of-the-art semiconductor technologies. As a result, it became possible to commercialize high efficacy and high luminous flux premium lighting products at both medium and high power.
Existing flip chip LED packages have been commercialized only as high-power LED light sources in the form of CSP (Chip Scale Package) in which reflective white resin is omitted and the process is relatively simple. However, the existing packages distributed in the market have critical problems that the bonding between the chip and the substrate melts to dislocate the chip and reduces the brightness by about 10% when exposed to high temperature.
It was difficult to ensure the quality of lighting with the existing flip chip LED packages with reflective white resin as the temperature of some of the processes for producing lighting modules and finished products reaches 250℃ or more. Flip chip LED packages developed by LG Innotek produce an efficiency of 220 lumens per Watt (lm/W) stably because the bonding between the chip and the substrate does not melt even at a temperature of 250 to 300℃. According to a representative from the company, lighting companies can use this flip chip LED package to produce premium bulbs, tubes and flat-panel lightings without sacrificing the light quality.
LG Innotek developed the flip chip LED package by improving the internal structure of the package, designing its own production process, and enhancing the existing flip chip mounting technology. The internal structure of the chip is newly designed with its proprietary technology to maximize the efficacy and heat dissipation performance. For more illumination, visit LG Innotek.