Finalists Revealed At MEMS & Sensors Summit

SEMI, with its Strategic Association partner MEMS & Sensors Industry Group (MSIG), announce a shortlist of competitors for the Technology Showcase, which will take place on September 21 at the SEMI European MEMS & Sensors Summit 2017 in Grenoble. Selected by a committee of industry experts, five finalist companies will demonstrate advancements in MEMS and sensors for markets that span Internet of Things (IoT), consumer electronics, robotics and biomedical. The audience will vote for a winner, which will be announced at the Summit’s conclusion.

 

Technology Showcase Finalists

Sponsored by Infosys

In Conversation with Antonio Neri, President & CEO – Hewlett Packard Enterprise & Salil Parekh, CEO – Infosys

Hear the CEOs of Infosys & HPE discuss the current crisis and how it has accelerated the need for digital transformation for their clients. Connectivity at the Edge, right mix of hybrid cloud, ability to extract data faster than ever before… these are just some of the contributions that HPE and Infosys make to our clients’ digital transformation journey.

 

  1. Bosch Sensortec GmbH: BML050 — a high-precision MEMS scanner for interactive laser projection applications, which offers a virtual user interface solution for IoT applications such as home appliances, tablets and social robots.
  2. Fraunhofer Institute for Photonic Microsystems: Integrated Capacitive Micromachined Ultrasonic Transducers (CMUTs) — provides miniaturized, highly sensitive, low-power, and customer-specific sensors and sensor nodes for applications in liquid and gases. Applications include human-machine interaction, robotics, biomedical, and smart consumer systems.
  3. Hap2U: Ultrasonic Piezoelectric Actuators for Smart Touchscreen Applications — gives users the sensation of feeling sliders, knobs and buttons while touching their display. Hap2U’s new approach to haptic feedback drastically reduces applied power and power consumption.
  4. Philips Innovation Services: CMUTs for Ultrasound and Non-Ultrasound Devices — complements conventional technology with advantages such as large bandwidth, easy fabrication of large arrays, and monolithic integration of ASIC functionality. Through Philips MEMS Foundry, CMUTs are available for medium- and high-volume manufacturing.
  5. Si-Ware Systems: NeoSpectra MEMS Spectral Sensors — features an FT-IR spectrometer on MEMS die. NeoSpectra MEMS Spectral Sensors enable tiny low-cost spectral sensors that are highly integrated, scalable and reliable, making them ideal for in-field and inline applications in various industries, including consumer electronics.

 

For more details, visit the MEMS & Sensors Summit website.

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