ST. FLORIAN, Austria /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, announced that Sweden-based Silex Microsystems, the "world's largest independent MEMS foundry," has placed a major follow-on order for its GEMINI automated bond cluster, EVG 6200NT mask and bond aligner, and EVG301 mask cleaner, all of which will be used in the production of highly sophisticated MEMS devices for applications spanning the biotech/medical, telecom, automotive and consumer electronics industries, among others. EVG reports that installation is slated for spring 2009 at Silex's new 8-inch MEMS facility—the "first of its kind in Europe"—located in Jarfalla, Sweden.
"Our company is dedicated to bringing advanced process technologies and manufacturing excellence to our nearly 80 customers worldwide," said Jan Nerdal, Silex CEO. "As a pure-play MEMS manufacturer, we expect only the best from our suppliers when it comes to delivering cost-effective yet, superior process capabilities, quality, and support. EVG has been a valued supplier to Silex since we commenced operations in 2000, consistently delivering over this time the wafer bonding and aligner solutions we've needed to manufacture our myriad best-in-class MEMS devices. Our recent order with EVG demonstrates the confidence we have in them toward helping us effectively transition from semi-automatic wafer bonding to fully automated production at our prized 8 in. MEMS fab, seamlessly and efficiently."
Commenting on the order, Paul Lindner, EVG's Executive Technology Director, noted, "EVG prides itself on our ongoing commitment to working closely with our customers to ensure their manufacturing processes, and ultimately, fab operations are running at benchmark levels. For close to three decades now, we've been delivering the best-of-breed equipment and process expertise to today's MEMS value chain-all at a low cost of ownership (CoO). Our longstanding relationship with Silex and recent follow-on order win speaks volumes to the satisfaction shared among today's MEMS community in our ability meet today's exacting MEMS manufacturing requirements."
EVG's GEMINI platform is a field-proven production manufacturing solution for high-volume wafer bonding applications for MEMS, 3D integration, and advanced packaging, as well as compound semiconductor applications. With more than 100 automated wafer bonder installations worldwide, the GEMINI is designed for the lowest total CoO and quickest return on investment. The tool incorporates EVG's patented SmartView bond aligner, which delivers high-precision aligned direct bonding. The GEMINI also features integrated pre-process modules, such as the EVG301 wafer cleaner. Moreover, the system can provide low-temperature plasma activation (silicon direct bonding) and is expandable through four bond chambers to achieve even higher throughputs. The recent order from Silex also includes EVG's 6200NT aligner, which is the newest generation of the company's more versatile precision alignment tools.
Silex Microsystems is an independent Swedish MEMS foundry that commenced operations in 2000. MEMS are complex mechanical and electrical systems on a micro scale, built in the form of a chip. The minute scale has great advantages, and MEMS usage is growing fast in the consumer electronic industry, automotive industry, and medical technology sector, among other industries. Silex has nearly 80 customers, of which 10 are large-volume customers. Development and production of MEMS takes place at the company's manufacturing plant in Jarfalla.
EV Group is a world leader in wafer-processing solutions for semiconductor, MEMS, and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL), and metrology equipment, as well as photoresist coaters, cleaners, and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator, compound semiconductor, and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, AZ.; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea; and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges, and expedite device manufacturing in high volume.