Etchable Thick Film Allows Ultra-Fine Circuit Lines

Remtec has commercialized etchable gold thick film process for High Definition Thick Film (HDTF) circuitry as a low-cost alternative to thin films.  The offering reportedly represents a significant advancement in miniaturization, circuit density and performance. The etchable gold substrates allow the use of ultra-fine lines with a standard line / spacing resolution of 50/50 µm (.002”) and premium circuit of 25/25 µm (.001”).


In addition to an etchable gold circuit, the company’s HDTF can incorporate conductor multilayers. It also integrates built-in components such as Lang couplers, inductors, filters and high precision resistors in a wide range from 50 mΩ to 1 MΩ laser trimmed to ±1% on the same ceramic base.

Sponsored by Anritsu Company

New VNA technologies enable mmWave broadband testing to 220 GHz, helping researchers and engineers to overcome test challenges and simplify mmWave testing.

Application development in the mmWave frequencies is growing. Broadband testing over hundreds of GHz of bandwidth is subject to repeatability/accuracy deficits, and engineers demand solutions to help overcome challenges and simplify mmWave testing.


Remtec supports the new line of advanced HDTF substrates with, state-of- the art processing equipment in a class 1000 clean room. Typical applications products requiring high circuit density and conductor proximity like radar, missile and satellite communications systems in both defense and industrial applications. For more details, visit Remtec.



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