DUBLIN and HSINCHU, Taiwan -- Endura Technologies (International) Ltd. announces a commercial partnership with MediaTek Inc. that aims at demonstrating power, performance, and area improvements at advanced process nodes. This marks the first milestone of Endura's embedded power solutions, using deep submicron technology, developed through their R&D centers in Dublin, Ireland and San Diego, California.
Endura and MediaTek have initiated their partnership by taping out eVR™ and ATC™ in advanced process nodes. Endura is proud to announce that MediaTek's latest product offerings will include Endura's innovative technology at the lowest process nodes.
Endura's eVR™, sVR™, and ATC™ solutions provide unprecedented reduction in bill of material and power usage, while also increasing performance. Endura's technology will provide MediaTek with a competitive advantage in the advanced FinFET nodes through superior power and battery life in a compact solution.
For more info, visit http://www.mediatek.com