STMicroelectronics’ Modular Telematics Platform (MTP) offers designers an open development environment for prototyping advanced Smart Driving applications, including vehicle connectivity to back-end servers, road infrastructure, and other vehicles. The MTP integrates a central processing module based on the just-launched Telemaco3P secure automotive-telematics processor and a comprehensive set of automotive-connectivity devices both on the board and in plug-in modules, ensuring development flexibility and extensibility. The Telemaco3P secure telematics processor is described as the industry’s first automotive processor to include a dedicated Hardware Security Module.
The MTP also integrates the company’s automotive-grade multi-constellation GNSS Teseo IC with dead-reckoning sensors and the Telemaco3P’s integrated advanced automotive security module. These can be further enhanced with an optional on-board ST33 Secure Element.
Additionally, the platform supports connecting automotive buses such as CAN, FlexRay, and BroadR-Reach® (100Base-T1) to the board directly, and optional Bluetooth™ low energy, Wi-Fi, and LTE modules offer access to wireless networks. Designed for advanced automotive telematics use cases including remote diagnostics and secure Electronic-Control-Unit (ECU) Firmware Over The Air (FOTA) updating, the MTP includes extension connectors for V2X and precise positioning modules. For more specs, a Telemaco3P datasheet is available. STMicroelectronics, Burlington, MA. 781-861-2650