SAN FRANCISCO, CA -- DesignCon, the conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities, announces recipients of its Best Paper Awards following a successful DesignCon 2016. Each of these winners are being awarded for their outstanding contribution to the educational goals of the DesignCon program. DesignCon's 2016 event commenced January 19-21 in Santa Clara, CA. To view the full list of winners, visit: ubm.io/PPRAwards16.
The 2016 DesignCon Best Paper Award winners have been chosen through a two-pronged judging process. First the DesignCon Technical Program Committee, comprised of leading experts in the electronic design space, reviewed all papers for originality, relevance, impact and quality. The resulting finalists were then judged based on the impact of their presentations, derived from attendee feedback collected at DesignCon 2016.
Winning papers fall into four design categories: High-Speed Signal Design, Memory & Parallel Interfaces, Test & Measurement, and Power Integrity…and the winners are:
High-Speed Signal Design
A Versatile Spectrum Shaping Scheme for Communicating Beyond Notches in Multi-Drop Interfaces
•Kiarash Gharibdoust, EPFL
•Ali Hormati, Kandou Bus
•Amin Shokrollahi, Kandou Bus
•Armin Tajalli, Kandou Bus
•Christoph Walter, Kandou Bus
Mid-Frequency Noise Coupling Between DC-DC Converters and High-Speed Signals
•Gustavo Blando, Oracle
•Laura Kocubinski, Oracle
•Istvan Novak, Oracle
Memory & Parallel Interfaces
Analysis and Verification of DDR3/DDR4 Board Channel Impact on Clock Duty-Cycle-Distortion (DCD)
•June Feng, Altera Corporation
•GaWon Kim, Altera Corporation
•Marjan Mokhtaari, Altera Corporation
•Balaji Natarajan, Altera Corporation
Optimal DDR4 System with Data Bus Inversion Feature in FPGA High Speed High Bandwidth Memory Interface
•Penglin Niu, Xilinx
•Changyi Su, Xilinx
•Thomas To, Xilinx
•Juan Wang, Xilinx
•Yong Wang, Xilinx
Test & Measurement
Jitter, Noise Analysis and BER Synthesis on PAM4 Signals on 400 Gbps Communication Links
•Maria Agoston, Tektronix
•Mark Guenther, Tektronix
•Kalev Sepp, Tektronix
•Pavel Zivny, Tektronix
BER- and COM-Way Channel Compliance Evaluation: What are the Sources of Difference?
•Vladimir Dmitriev Zdorov, Mentor Graphics
•Chuck Ferry, Mentor Graphics
•Cristian Filip, Mentor Graphics
•Alfred Neves, WildRiver Technology
A New Characterization Technique for Glass Weave Skew Sensitivity
•Eric Bogatin, Teledyne LeCroy
•Vidyadhar Deodhar, University of Colorado, Boulder
•Bill Hargin, Nanya
•Vinit Sonawane, University of Colorado, Boulder
•Anand Ursekar, University of Colorado, Boulder
Power Integrity
Impacts of Dynamic Noise in Multi-Core or SOC Designs
•Dan Oh, Altera Corporation
•Yujeong Shim, Altera Corporation
Electrical and Thermal Consequences of Non-Flat Impedance Profiles
•Jae Young Choi, Oracle Corporation
•Ethan Koether, Oracle Corporation
•Istvan Novak, Oracle Corporation
Chip and Package-Level Wideband EMI Analysis for Mobile DRAM Devices
•Chan-Seok Hwang, Samsung Electronics
•Sangnam Jeong, Samsung Electronics
•Hyo-Soon Kang, Samsung Electronics
•Jinwon Kim, Samsung Electronics
•Daehee Lee, Samsung Electronics
•Junho Lee, Samsung Electronics
•Jong-Bae Lee, Samsung Electronics
•Jieun Park, Samsung Electronics
•Jinsung Youn, Samsung Electronics
To learn more, visit http://www.designcon.com