CyweeMotion Partners with CEVA to Offer Complete Sensor Fusion Solution for Mobile and Wearables

MOUNTAIN VIEW, CA -- CEVA, Inc. and CyweeMotion Ltd. partner to offer a complete sensing solution targeting mobiles and wearables. The solution integrates CyweeMotion's Sensor Fusion Hub™ software with the CEVA-TeakLite-4 DSP, to deliver a fully optimized, low power sensor fusion platform for seamless integration into any device.

Sensor-fusion is a critical element in today's always-on, context aware smart devices, providing motion sensing, pedestrian navigation (PDR), gesture control and contextual awareness for smartphones and wearables. Many of these functions are required to be 'always-on', resulting in significant battery drain if implemented on the main CPU or other unsuitable processors. In contrast, implementing CyweeMotion's Sensor Fusion Hub on the CEVA-TeakLite-4 DSP, allows for up to 20x power savings.

"The ultra-low power CEVA-TeakLite-4 DSP combined with our Sensor Fusion Hub technology provides an outstanding sensor hub solution for any mobile or wearable SoC," said Dr. Shun Nan Liou, General Manager at CyweeMotion Ltd. "CEVA's comprehensive development environment enabled us to port and optimize our software easily and efficiently, resulting in a highly power efficient solution, in particular for 'always-on' applications."

Moshe Sheier, director of product marketing, audio and voice at CEVA stated: "CyweeMotion's Sensor Fusion Hub is a unique addition to our CEVAnet partner ecosystem and provides a compelling offering for our CEVA-TeakLite-4 based SoC designers and system integrators by providing a full contextual awareness software suite for a host of smart devices. The CyweeMotion solution is already silicon proven, running on one of our customer's SoC, and we are currently extending this partnership with other silicon vendors and OEMs."

The CEVA-TeakLite-4 is the fourth generation DSP based on CEVA-TeakLite, the most successful licensable DSP architecture in the history of the semiconductor industry, with more than 3.5 billion chips shipped, over 100 licensees, 35 active ecosystem partners and more than 100 audio, voice and sensing software packages available. The CEVA-TeakLite-4 is offered as a scalable and extensible architecture framework, allowing customers to choose the optimal family member core to address their specific audio/voice/sensing/connectivity application needs. By taking advantage of the unified software ecosystem, a set of optimized software libraries and the integrated development environment, customers can easily reduce software development costs significantly while leveraging their software investment in future products.

For more information, visit
http://www.ceva-dsp.com/CEVA-TeakLite-4
http://www.ceva-dsp.com

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