CyberOptics Showcases High-Precision Humidity Measurement Sensor

Shanghai, China --- CyberOptics Corporation, developer and manufacturer of high precision 3D sensing technology solutions, showcased WaferSense® and ReticleSense® Auto Multi Sensors (AMS) at SEMICON China, in the PSC and KNG booth #3358 and the Winifred booth #1461. The WaferSense and ReticleSense Auto Multi Sensor (AMS/AMSR) line measures relative humidity (RH) in real time. Process and equipment engineers can also measure vibration and leveling using this measurement device. With its thin and light form factor, CyberOptics’ AMS can travel through virtually any tool and the AMSR can be used in any reticle environment.

CyberOptics will also feature the new Airborne Particle Sensor (APS2) devices that improve equipment set-up and long-term yields in semiconductor fabs by wireless monitoring airborne particles in real-time. The new APS2 quickly monitors, identifies and enables troubleshooting of airborne particles down to .14um within semiconductor process equipment and automated material handling systems. It easily identifies when and where the particles originate and speeds equipment qualification with wireless measurements, shortens equipment maintenance cycles with wafer-like and reticle form factors and lowers equipment expenses by providing objective and reproducible data.

About the CyberOptic WaferSense and ReticleSense Line

The WaferSense measurement portfolio including the Auto Leveling System (ALS), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS), the Airborne Particle Sensor (APS), the next-generation Airborne Particle Sensor (APS2) and the new Auto Multi Sensor (AMS) are available in various wafer shaped form factors depending on the device, including 150mm, 200mm, 300mm and 450mm wafer sizes. The ReticleSense measurement portfolio including the Airborne Particle Sensor (APSR & APSRQ) and next-generation APS2, the Auto Leveling System (ALSR) and the new Auto Multi Sensor (AMSR) are available in a reticle shaped form factor.

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