Conductive Adhesive Stands Up To EMI Challenges

(Dow Chemical Company)

Dow Chemical Company’s DOWSIL EC-6601 electrically-conductive adhesive is a next-generation material engineered for reliable performance and electromagnetic compatibility (EMC) in electrical and electronics applications in the transportation, communications and consumer markets. The adhesive combines strong electromagnetic interference (EMI) shielding capabilities across a wide range of frequencies with durable mechanical and conductive properties over time.

DOWSIL EC-6601 bonds to many substrates and has greater than 150% elongation to enable flexibility at the joints. It can be used as an adhesive, formed-in-place gaskets (FIPG), or cure-in-place gaskets (CIPG). The silicone elastomer has an optimized dispense rate and withstands high temperatures, humidity, vibration, compression and tensile stress.

With its high elongation, the material can stretch to support the movement of a joint when used as an adhesive, FIPG or CIPG. Additionally, the adhesive contains premium fillers, and provides reliable corrosion resistance. For more details, peruse the DOWSIL EC-6601 datasheet.

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