ON Semiconductor’s programmable RF transceiver System in Package (SiP) integrates an advanced RF System-on-Chip (SoC) with all surrounding Bill of Material (BOM) parts including a TCXO. Dubbed the AX-SIP-SFEU, the SiP provides what the company calls its most integrated solution for both uplink (transmit) and downlink (receive) communications. The device is the first in a new family of SiPs that will emerge over the coming months supporting applications requiring Internet of Things (IoT) and industrial IoT (IIoT) connectivity.
The AX-SIP-SFEU transceiver measures 7 mm x 9 mm x 1 mm, almost one-third the footprint and one-tenth the overall size of a module-based solution. Delivered with conformal shielding and pre-certified radio regulatory approvals, it promises to simplify designs, decrease times to market, and reduce overall development cost by allowing users to focus on their application and antenna design.
Addressing the need for long battery life, the SiP specifies standby, sleep, and deep sleep mode currents of 0.5 mA, 1.3 µA, and 100 nA, respectively. It interfaces to an application circuit via a simple universal asynchronous receiver transmitter (UART) interface. AT commands are used to send frames and configure radio parameters, with an Application Programming Interface (API) variant available for those wishing to write their own software. A development kit and an integrated IDE for software developers are available. For more details, a datasheet is available. Also contact ON Semiconductor at 1-800-282-9855.