CMOS Sensor Performs Simultaneous 2D/3D Imaging

ON Semiconductor’s AR0430 CMOS digital image sensor combines classic 2D video imaging and 3D image recognition on a single sensor. With a small 1/3.1-inch optical format, the device delivers images via 2-µm pixel stacked BSI technology with a 4-Mpixel resolution at 120 fps. A unique depth mode enables depth mapping concurrently, while shooting video at 30 fps.


The AR0430 has an active-pixel array of 2312 (H) x 1746 (V), achieving a 4:3 aspect ratio. The device provides low-power performance, drawing a mere 125 mW, when a 4 MP data stream is operating at 30 fps. The low power monitoring mode drawing only 8 mW in standby, is especially valuable in battery-powered security applications. The AR0430 in standard imaging mode, can provide high quality images in both day and night lighting conditions, thereby enhancing its suitability for use in security cameras. This imager, with a large linear full well capacity and high dynamic range, succeeds in challenging light conditions with leading color performance. It can record video at 120 fps in slow motion mode and use the zoom feature, while retaining the resolution quality that is perfect for wearable devices. The feature of depth data at 30 fps promotes the possibility of object recognition, virtual replacement, or downstream AI, that can interpret data for autonomous decisions, or touchless device control.


Simultaneous video and depth mapping is enabled by ON Semiconductor's Super Depth technology, built on the latest stacked die technology. Super Depth Technology, together with the Color Filter Array (CFA) feature and on-pixel micro-lenses, creates a data stream containing both image and depth data. This data is combined off the sensor, via an algorithm, to deliver a 30-fps video stream and depth map of any object within one meter of the camera. Imaging engineers and system designers will benefit from the AR0430's significant configuration flexibility. This flexibility includes the ability to program gain, horizontal and vertical blanking, frame size/rate, exposure, image reversal, window size, and panning. Current engineering samples are available in bare die format, and full production will start later in Q1' 2018. More details and a datasheet are available.