Chipset Ushers In Next-Gen AR Head-Up Displays

As per Texas Instruments. its DLP3030-Q1 chipset with supporting evaluation modules (EVMs) gives automakers and Tier-1 suppliers the ability to bring bright, dynamic augmented reality (AR) displays to windshields and place critical information within the driver's line of sight. By way of the DLP architecture that enables HUD systems to withstand the intense solar loads created when projecting long VIDs, designers can develop AR HUD systems that project virtual image distances (VIDs) of 7.5m and greater.


DLP3030-Q1 chipset features include a ceramic pin grid array package (CPGA) that reduces the digital micromirror device (DMD) footprint by 65%, an operating temperature from -40°C to +105°C, and a 15,000 cd/m2 brightness with the full color gamut (125% NTSC)


Available support packages:

  • DLP3030-Q1 Electronics EVM allows developers and Tier-1 suppliers to create their own custom PGUs for HUD systems.
  • DLP3030-Q1 PGU EVM gives designers the tool they need to develop new HUDs based on DLP technology or benchmark DLP technology performance in existing HUD designs.
  • DLP3030-Q1 Combiner HUD EVM enables automakers and Tier-1 suppliers to evaluate full system performance using DLP technology in one easy-to-use tabletop demonstration.

The DLP3030-Q1 chipset is available in a 32 mm x 22 mm CPGA package. The EVMs are priced as follows: DLP3030-Q1 Electronics EVM (DLP3030Q1EVM) US$1,999; DLP3030-Q1 PGU EVM (DLP3030PGUQ1EVM) US$6,500; DLP3030-Q1 Combiner HUD EVM (DLP3030CHUDQ1EVM) US$25,000. For more information, visit the DLP3030-Q1 chipset page.

Suggested Articles

An accelerometer measures the rate of change of an object’s velocity to monitor its movement.

From cell phones to industrial manufacturing, knowing when an object (or a person!) is nearby is a basic sensing requirement.

Compact and rugged sensors from Balluff monitor temperature of fluids and compressed air.