CEVA and LG Electronics are working together on the development of a high-performance, low-cost smart 3D camera for consumer electronics and robotics. The 3D camera module incorporates a Rockchip RK1608 coprocessor with multiple CEVA-XM4 imaging and vision DSPs, which provide the processing power to perform a wide variety of 3D sensing applications. These include biometric face authentication, 3D reconstruction, gesture/posture tracking, obstacle detection, AR and VR.
Computer vision experts from CEVA, Rockchip and LG worked closely together to optimize LG’s proprietary algorithms for the CEVA-XM4 using CEVA’s tool kit and optimized algorithm libraries ensuring optimal performance under stringent power constraints. More information on the camera and DSP imaging is available from CEVA.