The CEA (Atomic Energy Commission) and Intel are boosting their collaboration through a new R & D agreement signed in Paris on Thursday 12 May. This collaboration, extended to several key areas in digital technology, will enable the two sides to develop a shared R&D programme and jointly submit research and innovation projects on a European scale, particularly as regards High Performance Computing (HPC), as part of the Horizon 2020 programme.
The new CEA-Intel agreement involves several strategic research programmes with the teams of the CEA's Leti Institute in Grenoble, including the Internet of Things, high-speed wireless communication, security technologies and 3D displays.. It also means that the two companies will work together to jointly submit projects to Europe's biggest innovation and research programme, Horizon 2020.
This agreement, concluded for a minimum of five years, concerns the current development of digital technologies and the Internet of Things (IoT), including:
• The development of new materials in order to further the miniaturisation and adaptability of electronic components used in mobile phones. The nature of these components and their layout are crucially important to the system's performance, size and cost.
• The development of wireless communication systems and faster exchanges,
• The integration of connected objects and the study of low-consumption communication technologies.