SHANGHAI -- Brite Semiconductor announces the collaborative development of a design platform roadmap with key industry partners, including Semiconductor Manufacturing International Corporation ("SMIC"). The platform is designed to support Internet-of-Things ("IoT") IC's addressing the China market's emerging needs for smart devices, wirelessly-connected to Cloud infrastructure.
Brite is developing its China IoT ASIC Platform based on SMIC's 55nm low-leakage (LL) and ultra-low-power (ULP) process roadmap, which includes embedded flash (eFlash) memory. Over the design platform's lifetime, these processes can significantly reduce operating voltages to lower both active power and standby power consumption, which will be the best choice for IoT devices including smart home and wearable products.
"An early leader in custom design services in China, Brite is uniquely positioned to work with SMIC foundry services in providing rapid and optimized IoT device realization for China's emerging market opportunities," stated Dr. Charles Zhi, President and CEO of Brite Semiconductor, "Key to IoT applications is wireless connectivity and our CEVA platform cooperation assures seamless connectivity at the periphery of the Cloud."
"SMIC is constantly developing advanced technologies. Based on ULP technology platform, we have taken the lead in offering ULP foundation IP library, commercial Bluetooth and BLE IPs, and modularized embedded non-volatile memory (eNVM) to form a comprehensive IoT based technology platform," stated Dr. TianShen Tang, Senior VP of SMIC Design Service. "We're glad to see Brite has collaborated with other strategic partners to develop the IoT ASIC platform together. We believe that the cooperation between SMIC and Brite in IoT can help make China's rapidly developing infrastructure the smartest in the world."
CEVA, already a Brite and SMIC IP partner, is collaborating with Brite on Bluetooth baseband and DSP platform integration into the China IoT ASIC platform. CEVA's Bluetooth IP consists of a hardware baseband coupled with a controller software stack up to HCI. Compliant with all versions up to Bluetooth Smart Ready 4.2 (dual mode), its innovative low power architecture makes it an ideal fit for wireless combo, microcontroller and application processors to address a wide range of embedded applications. For IoT applications requiring local intelligent processing, the CEVA DSPs can be integrated into the platform to enable applications such as voice activation, speech recognition, sensor fusion, face detection and fingerprint recognition. Benefits include reduced latency for time-critical applications, increased privacy, lower data transfer overhead and lower overall power consumption.
"We are pleased to partner with Brite Semi in offering their ASIC platform customers world-class connectivity and processing capabilities for their customized wireless IoT devices," said Eran Briman, Vice President, Marketing at CEVA. "Our Bluetooth IP delivers the lowest power consumption for both Bluetooth Smart and Smart Ready devices, while our DSP platforms bring the capability to handle the intelligence processing directly on the device, where required."
In April of this year, The National Center for Advanced Packaging Co., Ltd., a company dedicated to developing and commercializing advanced packaging and system integration technologies, joined with Brite to announce a research and development (R&D) collaboration targeting single and multi-die Systems-on-Chip (SoCs ) and System-in-Package (SiPs ). This collaboration will include support for the China IoT ASIC Platform roadmap and SoC integration into multi-die packaging which will be a key to successful IoT solutions that integrate sensors, MCUs, and radios into a single package.