Enabling high-density, the 5853 Series board-to-board connector sports a 0.35-mm pitch, stacking height of 0.6 mm between boards, and a width of 2.4 mm. This is 0.2-mm lower in stacking height compared to the conventional 5843 Series with the same pad pattern. A stacking height of 0.8mm (5843 series) is also available, enabling flexible design. For more details, visit http://www.kyocera-connector.com/en/index.html and for a datasheet, go to http://www.kyocera-connector.com/en/wp-content/uploads/2014/08/5853.pdf
KYOCERA Connector Products Corp.
Santa Clara, CA