AI Forecasts New Era Of Advanced Packaging

Artificial Intelligence (AI) is driving the development of 3D TSV and heterogeneous integration technologies, so says the 3D TSV & 2.5D business update report by Yole Développement (Yole), part of Yole Group of Companies. The research firm investigates the advanced packaging industry and takes a closer look on the AI impact on this market.

 

Initially developed for niche markets including MEMS devices and memories for datacenters, 3D integration is entering in a new era. The world population increase, the exploding smartphones market, the development of new functionalities such as voice/image recognition… all these parameters directly contribute to the development of AI and deep learning solutions, all based on 3D integration technologies. AI is not a concept anymore but a reality that is skyrocketing the development of disruptive advanced packaging technologies.

Sponsored by Digi-Key

Digi IX20 Secure LTE Router Available for Immediate Shipment from Digi-Key

The IX20 rugged, secure LTE router is a great choice for applications from basic connectivity to industrial-class and security solutions. Its high-performance architecture gives primary and backup WWAN over software selectable multi-carrier LTE.

 

Why do we need 3D TSV solutions, especially in high performance applications? According to Yole, benefits are numerous and are part of the major issues initially identified by the industrial companies. Bandwidth, latency and power consumption are the key words of these innovations. To read the complete story, CLICK HERE.

Suggested Articles

Sidewalk is designed to allow neighbors to share a wireless network for IoT devices

President Trump issued his “blessing” of the tentative deal on Saturday and then directed a delay of a week of a ban on TikTok downloads.

Company also foresees a Poseidon generation for 2022 and beyond