Picosun Oy, a supplier of Atomic Layer Deposition (ALD) thin film coating technology for global industries, partners with STMicroelectronics to develop the next generation 300-mm production topologies for advanced power electronics. Most power semiconductor industries use 200-mm wafers as substrates. Transfer to 300-mm enables more efficient, ecological, and economical production through larger throughputs with relatively smaller material losses, and adaptation of novel manufacturing processes such as ALD allows smaller chip sizes with increased level of integration.
As a part of the funded project R3-POWERUP, Picosun's PICOPLATFORM 300 ALD cluster tool will be optimized and validated for 300 mm production of power electronic components. The SEMI S2 certified PICOPLATFORM™ 300 cluster tool consists of two PICOSUN P-300S ALD reactors, one dedicated for high-k dielectric oxides and one for nitrides, connected and operated under constant vacuum with a central vacuum robot substrate handling unit. The ALD reactors are equipped with Picosun's proprietary Picoflow feature which enables conformal ALD depositions in high aspect ratios up to 1:2500 and even beyond. Substrate loading is realized with an EFEM with FOUP ports. The fully automated cluster tool can be integrated into the production line and connected to factory host via SECS/GEM interface.
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