Dr. Enquist is the VP of 3D R&D at Xperi, Inc. He has over 30 years of experience, written for over 130 publications and presentations, and holds over 50 issued US patents related to high speed devices and circuits, low temperature direct bonding, and 3D integration. He holds Ph.D. and M.S. degrees in Electrical Engineering from Cornell University and a B.S. degree in Engineering from Columbia University. He is an IEEE senior member, member of Tau Beta Pi and Eta Kappa Nu.